Using the liquid bubble encapsulation technology, the transparent liquid with high thermal conductivity is filled into the lamp bulb. This is in addition to the principle of light reflection, the only use of LED chips out of the heat conduction surface, heat dissipation technology.
The use of lamp caps
In home-type smaller power LED heat sinks, the interior of the lamp head is often used to partially or completely put the heat-generating drive circuit. In this way, it is possible to dissipate heat from a lamp with a large metal surface, such as a screw base lamp, because the lamp head is in intimate contact with the lamp holder metal electrode and the power cord. Therefore, a part of the heat can be derived therefrom.
Thermal Conduction and Heat Dissipation Integration--Application of High Thermal Conductive Ceramics
The purpose of the heat dissipation of the lamp shell is to reduce the operating temperature of the LED chip. Since the expansion coefficient of the LED chip and the common thermal expansion coefficient of the metal thermal conductivity and the thermal expansion material are greatly different, the LED chip cannot be directly soldered to prevent the high and low temperature thermal stress from destroying the LED chip. The latest high thermal conductivity ceramic material has a thermal conductivity close to that of aluminum, and the expansion system can be adjusted to synchronize with the LED chip. In this way, heat conduction and heat dissipation can be integrated to reduce the heat conduction intermediate links.